YAG Laser System For Decapsulation

With the recent conversion from gold wires to copper wires, it is often necessary to use laser ablation to remove plastic encapsulation followed with either a downstream plasma etcher or acid decapsulation. At Chip Targets Inc, we have developed recipes to perform such tasks. Our recipes were developed to control the thermal effect of laser on the component. Below are the equipment we use:


  1. 80W YAG Laser
  2. Down Steam TEPLA 100-E Plasma Etcher
  3. Nisense D2 Jet Etcher