Real Time X-Ray Inspection – Dage XDAT 6500
The Dage XDAT 6500 is a universal system for component and material analysis. Some of its applications include the analysis of faulty eutectic die bonding, wire bonding flaws, wire sagging, through-hole plating integrity, and solder joint inspections.
System Capabilities and Specifications:
- Maximum board dimensions: 24″ x 24″ (610 mm x 610mm)
- X-ray Energy: max 160KV
- Focus Resolution: 1um
