Real Time X-Ray Inspection – Dage XDAT 6500

The Dage XDAT 6500 is a universal system for component and material analysis. Some of its applications include the analysis of faulty eutectic die bonding, wire bonding flaws, wire sagging, through-hole plating integrity, and solder joint inspections.

System Capabilities and Specifications:

  • Maximum board dimensions: 24″ x 24″ (610 mm x 610mm)
  • X-ray Energy: max 160KV
  • Focus Resolution: 1um