Rework, Reball, Repackaging Capabilities
Chip Targets Inc. can rework/reball BGA devices. We can replace damaged solder balls with PbSn (eutectic) or lead-free solder balls. Chip Targets Inc. can also remove the die from one type of package or from a flex board , and then repackage them to another type of package such as open top plastic (scoop and goof), ceramic, or BGA packages.
System Capabilities and Specifications:
- Can reball device down to 0.4mm pitch BGA and Chip Scale Packages with PbSn or leadfree solder balls.
- Can repackage device down to 55um bond pad pitch.
- Why Repackage?
- Gain Access to the backside of the die (too many metal layers, stack die, etc.)
- Repackage to a secondary package if test hardware/software is only available for the secondary package (eg. Flex devices, etc.)
