At Chip Targets Incorporated, we use the following technique or a combination of the following techniques for decapsulations:
- Laser ablation
- Jet Etcher Acid Decapsulation (Nisene Copper Protect)
- Down Stream Plasma Deapsulation (Tepla)
- Microwave Induced Plasma Decapsullation (Jiaco Instruments)
System Capabilities and Specifications:
- Can Decap Gold, Copper, and Silver bond wires
- Plasma Decap to avoid contaminations
- Specialize in decapsulations for bond tests (bond pulls, ball shear, and die shear tests)
- Temperatures (15C to 240C).
- Acids: Fuming Nitric Acid, Fuming Sulfuric Acid, or mixture of both acids.
- Laser Ablation
