At Chip Targets Incorporated, we use the following technique or a combination of the following techniques for decapsulations: 

  • Laser ablation
  • Jet Etcher Acid Decapsulation (Nisene Copper Protect)
  • Down Stream Plasma Deapsulation (Tepla)
  • Microwave Induced Plasma Decapsullation (Jiaco Instruments)

System Capabilities and Specifications:

  1. Can Decap Gold, Copper, and Silver bond wires
  2. Plasma Decap to avoid contaminations
  3. Specialize in decapsulations for bond tests (bond pulls, ball shear, and die shear tests)
  4. Temperatures (15C to 240C).
  5. Acids: Fuming Nitric Acid, Fuming Sulfuric Acid, or mixture of both acids.
  6. Laser Ablation