Chip Targets covers a wide range of options. Therefore, we encourage businesses interested in our services to get in touch with us by calling (972) 470-9290 Monday through Friday, 8am-5m CST. For general inquiries, please feel free to email us via our Contact Page. We look forward to discussing your project with you.
Failure Analysis Capabilities:
- 2D and 3D X-ray Analysis (Dage X-ray)
- Surface Analysis XPS/ESCA (Thermo Fisher Nexsa)
- Focus Ion Beam – Dual Beam FIB/SEM and Single Beam FIB with Layout Nagivation (FEI Strata 400S and FEI V600)
- OBIRCH / TIVA / Photo Emissions / Thermal Mapping / IR Hot Spot Analysis (Hamamatsu PHEMOS1000 and QFI QuantumScope)
- Cross Section and Polish Using Broad Beam Ion Mill Machines (Hitachi IM4000 and Leica RES101)
- Scanning Acoustic Microscope (SAM) for Void and Delamination Detections (Sonix ECHO VS)
- Electrical Testings
- Decapsulations Using Laser, Acid, and Plasma Techniques (Nisene Copper Protect, Jiaco MIP)
- Optical, Keyence, Nomarski Inspections
- Field Emission SEM and Energy Dispersive Spectrometry EDX
- Rework, IC Packaging and Repackaging
- Transmission Electron Microscopy
