We pride ourselves on accurate and fast turn-around failure analysis, and stand out in the industry by having state-of-the-art failure analysis equipment available in-house.
At Chip Targets Inc, we use our in-house Nordson Dage Optima Bond Testers.
System Capabilities and Specifications:
• IPC-TM-650 test method
• Bond Pull cartridge WP100 (up to 100g bond pull)
• Die Shear cartridge DS100kg (up 100kg)
• Ball Shear cartridge BS250R (up to 250g)
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