Quick Device Review

Chip Targets’ Quick Device Review is intended to provide our customers a technical snapshot of the device to provide them with a better understanding of the device cost and design. By purchasing this analysis, a customer will receive:

(1) A soft copy (jpg format) and a 36” plot of the die montage with pin labels. The die montage was obtained by stitching together images of the die taken at 358X or 716X

(2) a soft copy (pdf format) of an investigative report (about 20 pages)

Circuit Extraction Report

Chip Targets’ Circuit Extraction Report is intended to provide our customers a schematic of either whole or parts of a design. By purchasing this analysis, a customer will receive:

(1) A soft copy (jpg format) and a 36” plot of the die montages at each Metal levels and at polysilicon level. Typically, a top level die montage will include pin label, and a polysilicon (or silicon) level die montage will include the component labels. The die montages are obtained by taking stitching together a set of photographs taken at high magnification to allow circuit verification.

(2) A detailed schematic showing all the net connections and the components with appropriate information such as W/L for MOS, emitter area for bipolars, number of squares of resistors, and area for capacitors.

Constructional Analysis Report

Chip Targets’ Constructional Analysis Report is intended to provide our customers a detail understanding of how a device was fabricated. A typical report may include the following analysis:

1. Top and cross-sectional views using optical, scanning electron microscope (SEM), and transmission electron microscope (TEM) analysis

2. Material analysis using Auger, SIMS, EDS, Spreading Probe Resistance

3. Device Characterization such as resistance, capacitance, VT, Ioff, etc.

Product Teardown Report

Chip Targets’ Product Teardown Report is intended to provide our customers a detail understanding of how a device such as PDA and cell phones were assembled. A typcial report may include the following analysis:

1. Photographs of the device and its components

2. Documentations of the components names and its manufacturers

3. Measurements of the device performance

Sample Reports

Sample Report A
Sample Report B
Sample Report C