Chip Targets’ Constructional Analysis Report is intended to provide our customers a detail understanding of how a device was fabricated. A typical report may include the following analysis:

1. Top and cross-sectional views using optical, scanning electron microscope (SEM), and transmission electron microscope (TEM) analysis

2. Material analysis using Auger, SIMS, EDS, Spreading Probe Resistance

3. Device Characterization such as resistance, capacitance, VT, Ioff, etc.