Sonix Scanning Acoustic Microscope UHF 2000

Sonix Scanning Acoustic Microscopy is a non-destructive package analysis technique. This technique is mainly used to determine delaminations and voids at the die surface (C-Mode SAM and TAMI) as well as the die and thermal pad interfaces (Thru-SAM). For further information, please click the following Sonix training document.

System Capabilities and Specifications

  • C-Mode SAM, TAMI, and Through SAM analysis capabilities.
  • 15MHz, 75MHz, 110MHz, and 150MHz Transducers
  • 5 um resolution in horizontal directions.